Power Modules

Reliable ceramic substrates designed for efficient power handling.

Close-up of a power module with ceramic substrate and metal contacts under bright industrial lighting.
Close-up of a power module with ceramic substrate and metal contacts under bright industrial lighting.
SiC & GaN

Advanced ceramic packaging tailored for silicon carbide and gallium nitride power electronics, ensuring superior thermal management and durability in demanding environments.

High-tech SiC and GaN semiconductor devices mounted on ceramic substrates in a cleanroom setting.
High-tech SiC and GaN semiconductor devices mounted on ceramic substrates in a cleanroom setting.
Automotive Electronics

Robust ceramic solutions supporting automotive power electronics with high reliability and thermal performance for electric and hybrid vehicles.

Applications

Tailored ceramic solutions for power, automotive, and high-reliability electronics.

Power Modules

High-performance substrates designed to handle demanding power electronics efficiently.

Close-up of a ceramic substrate integrated into a power module assembly with visible connectors.
Close-up of a ceramic substrate integrated into a power module assembly with visible connectors.
Automotive

Robust packaging solutions built to withstand harsh automotive environments and thermal cycles.

Ensuring reliability and performance in electric vehicles and advanced driver-assistance systems.

Optoelectronics
Industrial optoelectronic device mounted on a ceramic substrate under precise assembly conditions.
Industrial optoelectronic device mounted on a ceramic substrate under precise assembly conditions.
High-reliability electronic packaging components arranged neatly on a clean white surface.
High-reliability electronic packaging components arranged neatly on a clean white surface.

Gallery

Ceracore's ceramic substrates in real-world applications.

Close-up of a DBC ceramic substrate integrated into a power module assembly.
Close-up of a DBC ceramic substrate integrated into a power module assembly.
High-resolution shot of an HTCC ceramic package used in industrial power electronics.
High-resolution shot of an HTCC ceramic package used in industrial power electronics.
SiC power electronic device mounted on a DPC ceramic substrate under inspection.
SiC power electronic device mounted on a DPC ceramic substrate under inspection.
Optoelectronic packaging featuring AMB ceramic substrates with precise component placement.
Optoelectronic packaging featuring AMB ceramic substrates with precise component placement.

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